Scia Systems – Ion Beam Deposition Systems – scia Coat 200 & scia Coat 500

Both Coat 200 and 500 systems operate on the IBS principle, in which the primary source sputters material from target to the substrate. Both systems also have the option to upgrade to DIBS configuration.

Key Features

Both Coat 200 / 500

• Excellent uniformity by (substrate rotation and tilt – Coat 200) and (linear movement – Coat 500)
• Up to five / six (Coat 200 / 500, respectively) water-cooled target materials on a rotational holder for in-situ change
• Recipe controlled multilayer deposition with quartz crystal oscillator and/or optical thickness monitor (OTM) and test glass changer
• Vertical or face-down substrate orientation for minimized particle load

Coat 200

• Direct wafer handling or adaptation to variable substrate sizes with carrier handling
• Equipped with a 350 mm ion beam assist source is also usable for ion beam etching processes

Coat 500

• Controlled movement of linear axis system for gradient coating or surface error correction
• Optional substrate heating up to 250 °C to optimize film stress

Available Models

Ion Beam Deposition – Multilayer coatings – scia Coat 200

Technical Specifications

Substrate diameter	Up to 200 mm diameter; Carrier handling for multiple substrate sizes available
Substrate holder	Water cooled, Helium backside cooling contact; Substrate rotation 5 to 20 rpm; Tiltable in‑situ from 0° to 170° in 0.1° steps
Ion beam sources	Sputter source: RF120‑e
	Assist source: RF120‑e or RF350‑e
Neutralizer	Plasma bridge neutralizer:
	Filament driven N‑DC or RF driven N‑RF
Target holder	Target drum with 4 targets (tiltable),
	each with max. 300 mm dia.
Typical deposition rates	Al: 10 nm/min; Al2O3: 15 nm/min
Uniformity variation	≤ 1.5 %
Base pressure	≤ 5 x 10-7 mbar
System dimensions (W x D x H)	2.70 m x 1.70 m x 2.40 m
	(without electrical rack and pumps)

The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.

The scia Coat 200 applies a beam from a focused broad beam ion source onto a sputter target. The beam of the assist ion source is directed to the substrate. By ion bombardment it is possible to control film characteristics or pre-clean the substrate.

If the system is equipped with a RF350‑e ion beam source as assist source, ion beam milling processes are also available on the same tool.

Ion Beam Deposition – Multilayer coatings – scia Coat 500

Technical Specifications

Substrate diameter	Up to 200 mm with load-lock
	500 mm x 300 mm with manual loading
Ion Beam Source	Rectangular microwave ECR-source LIN380‑e
Neutralizer	Plasma bridge neutralizer N‑DC
Target Holder	Target drum with 6 targets (tiltable), each with max. 400 mm x 200 mm
Typical deposition rate	Si: 10 nm/min
Axes performance	Linear from 0.01 mm/min up to 15 mm/min; Rotation up to 300 rpm
Uniformity deviation	≤ 0.5 % over 200 mm dia.
	≤ 2 % over 500 mm x 300 mm
Base pressure	≤ 5 x 10-8 mbar
System dimensions (W x D x H)	3.30 m x 1.70 m x 2.10 m
	(without electrical rack, pumps and load-lock)
Tool configurations	1 process chamber, 1 load-lock optional
Software interfaces	SECS II / GEM, OPC on request

The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

The scia Coat 500 applies a beam from a linear ion beam source onto a rectangular sputter target. This linear geometry provides a good homogeneity of the deposited film in one dimension. Meanwhile, the sample is moved on a linear axis in a direction perpendicular to the beam’s profile, thereby contributing to homogeneity or defined gradients of the coating in the second dimension.

In addition the sample stage is equipped with a spin rotation and a changeable shaper system (up to 4  shapers) in front of the sample stage.

Key Industries

• Semiconductor, Solar & Electronics