Semiconductor and Electronics

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  • ExtraEye - First Article Inspection Systems - A-6000

    ExtraEye – First Article Inspection Systems – A-6000

    The A6000 is a hardware/software system designed to assist in-line SMT production and find missing components, component errors, polarity errors, and rotation and offset faults. It is intended to minimize machine errors and human errors before the…

    The A6000 is a hardware/software system designed to assist in-line SMT production and find missing components, component errors, polarity errors, and rotation and offset faults. It is intended to minimize machine errors and human errors before they multiply in production. The hardware part includes a chassis carrying an XY axis system equipped with a camera producing high quality images and capable of inspecting all types of electronic components in top view, up to chip 01005 format. By automatically comparing a sample or the entire production, ExtraEye reduces operator fatigue and helps maintain stable and compliant production.

  • ExtraEye - First Article Inspection Systems - X-3040T & X-4040T

    ExtraEye – First Article Inspection Systems – X-3040T & X-4040T

    ExtraEye is a hardware/software system designed to assist operators of all levels in the FAI production head validation process.The hardware part includes a chassis with motorized X/Y axes carrying a camera producing high qualit…

    ExtraEye is a hardware/software system designed to assist operators of all levels in the FAI production head validation process.The hardware part includes a chassis with motorized X/Y axes carrying a camera producing high quality images and capable of inspecting any type of component in top view up to chip 01005 format. By presenting an image of the assembled components in relation to BOM details as well as assembly drawings, ExtraEye significantly improves inspection speed, reduces operator fatigue and therefore provides accuracy of 100% inspection.

  • Viscom - Bond Inspection X7056-II BO 

    Viscom – Bond Inspection X7056-II BO 

    The inspection system X7056-II BO effectively combines optical in-line wire bond control with automatic X-ray inspections. This comprehensive inspection concept enables higher efficiency, optimizes cycle times and thus improves throughput. Where t…

    The inspection system X7056-II BO effectively combines optical in-line wire bond control with automatic X-ray inspections. This comprehensive inspection concept enables higher efficiency, optimizes cycle times and thus improves throughput. Where the bottom line is concerned, procurement costs are significantly lower than purchasing two separate inspection systems.

  • Viscom - Optical Inspection iS6052 THT

    Viscom – Optical Inspection iS6052 THT

    The iS6052 THT inspection system is the most efficient quality control inspection of Viscom. Engineered for precise component placement verification on THT (Through-Hole Technology) boards. Utilizing advanced AOI (Automated Optical Inspection) tec…

    The iS6052 THT inspection system is the most efficient quality control inspection of Viscom. Engineered for precise component placement verification on THT (Through-Hole Technology) boards. Utilizing advanced AOI (Automated Optical Inspection) technology, it inspects from above the PCB, setting it apart from conventional systems that inspect from below.

  • Viscom - Solder Paste Inspection – iS6052-SPI 

    Viscom – Solder Paste Inspection – iS6052-SPI 

    The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, …

    The iS6052 SPI is Viscom’s cutting-edge solution for precise solder paste inspection in SMD production. With over four decades of expertise behind it, this 3D inline system ensures comprehensive evaluation of key solder features such as volume, height, shape, and more. 

  • Viscom - X-ray Inspection - iX7059-One

    Viscom – X-ray Inspection – iX7059-One

    The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semico…

    The iX7059 One can guarantee exceptional precision, with a resolution down to 1µm, ensuring every detail is captured with accuracy. This advanced system offers versatile 2D, 2.5D, and 3D X-ray inspection capabilities, making it perfect for semiconductor, power module, and leadframe applications.

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