Achilles offers a full range of wafer carriers models depending on the wafer types, all using antistatic and high-purity material, and compatible with packing machines.

ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.

KOPEL KSM Series probe bars enhance the measurement accuracy and repeatability of PV cell IV measurement by providing much higher precision and durability than competitors’ products.
The KOPEL KSM Series probe bars are incorporated into the KOPEL KSX-1000 high-performance solar cell test system and the KSX-3000H high-efficiency solar cell test system.

The chuck repair service is dedicated to wafer chucks damaged in device manufacturing processes to a state equivalent to new using our vast knowledge of ceramics.

We can provide optimal pin chucks tailored to strict requirements through customized design using world-class flattening process technology (flatness of 0.2 μm for 12-inch chucks).

Can flexibly be adjusted planar shapes of pin chucks with variable unevenness according to the shapes of wafers and customize absorption zones and pin patterns to enhance absorption responsiveness:

The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. Typical applications of the system are frequency and thickness trimming in manufacturing of acousto-electrical devices and filters such as bulk acoustic wave (BAW) or surface acoustic wave (SAW) devices, localized pole trimming for thin film heads (TFH) and trimming of precision thin film resistors.

The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.

The scia Cube 300/750 are designed for large area high density plasma processes of substrates up to 300 mm x 200 mm (scia Coat 300) and up to 750 mm x 750 mm (scia Coat 750). Typical applications are deposition of Diamond Like Carbon (DLC) for optical filters and dielectric films for anti-reflective coatings as well as etching processes with oxygen or halogen chemistry for the structuring of Semiconductors and metals.