SET – ACCµRA Plus
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
Key Features
- Accuracy ± 0.5 µm
- High accuracy and high throughput
- Throughput 120 UPH
- Full automatic
- High flexibility and reliability
- Ultra-small dies
Technical Specifications
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SET – ACCµRA Plus
Applications
- Laser diode, laser bar
- VCSEL, photo diode
- LED
- Prisms, lenses, mirrors
- Micro Assembly
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate bonding
Industries
- Optoelectronics and Silicon Photonics
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL)…
